Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement

Discover groundbreaking insights into the complexities of modern electronic circuit design in "Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement" by Yue Ma. Published by Taylor & Francis Ltd in 2019, this hardback edition spans 226 pages and delves into the critical challenges posed by the entanglement of electrical, thermal, noise, and interconnect domains in the realm of 3D nano-electronics.

This book serves as a vital resource for engineers and researchers, aiming to establish a new paradigm by synthesizing various technical aspects. By addressing the intertwined nature of these issues, Yue Ma provides readers with the tools needed to navigate the evolving landscape of electronic design. Enhance your understanding and stay ahead in the field with this essential addition to your professional library.