Noise Coupling in System-on-Chip

Discover the intricate world of noise coupling in integrated circuits with Noise Coupling in System-on-Chip by Thomas Noulis. Published by Taylor & Francis Inc in 2017, this comprehensive hardback edition spans 518 pages and features contributions from leading international experts in the field. The book delves into critical topics such as substrate and interconnect magnetic crosstalk, noise coupling in both 2D and 3D circuits, and the role of Through-Silicon Vias (TSV) in simulation techniques. It equips readers with the necessary tools to effectively analyze crosstalk noise as it propagates through parasitic interconnects, packages, and printed circuit boards (PCBs). Ideal for professionals and researchers alike, this book is essential for anyone looking to deepen their understanding of electronic noise and its implications in System-on-Chip designs.