Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990

Explore the cutting-edge world of micro- and nanoelectronics with Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990 by Qinghuang Lin. Published by Cambridge University Press in 2014, this comprehensive paperback spans 358 pages, offering invaluable insights into the latest advancements in interconnects and packaging technologies.

This essential volume serves as a dynamic forum for sharing knowledge on materials, processes, and integration techniques, focusing on the reliability of advanced interconnects. It covers critical topics such as 3D chip stacking, optical interconnects, and their applications in emerging fields like optoelectronics, plastic electronics, and molecular electronics. Ideal for professionals and researchers alike, this book is a must-have resource for anyone looking to stay ahead in the rapidly evolving landscape of integrated circuits and very large scale integration.