Handbook of Semiconductor Interconnection Technology

Discover the essential resource for professionals in the semiconductor industry with the Handbook of Semiconductor Interconnection Technology by Taylor & Francis Inc. This comprehensive guide, published in 2006, spans 536 pages and is now in its second edition, ensuring you have the latest insights and techniques at your fingertips.

This book meticulously details the equipment utilized in semiconductor manufacturing, focusing on deposition and etching processes, including the critical role of electrochemical deposition equipment for copper plating. Additionally, it emphasizes the measurement of mechanical and thermal properties, incorporating advanced techniques such as Electron Energy Loss Spectroscopy (EELS), energy-filtering Transmission Electron Microscopy (TEM), and atomic force microscopy.

Whether you are a seasoned professional or a newcomer to the field, this handbook is an invaluable addition to your library, providing practical knowledge and expert guidance in semiconductor interconnection technology.