Three-Dimensional Integration and Modeling
Kirjan tiedot
| Kirjoittaja | Jong-Hoon Lee |
|---|---|
| Kustantaja | Springer International Publishing AG |
| Julkaistu | 2007 m. |
| Kieli | Englanti |
| Sivumäärä | 108 psl. |
| Sidosasu | Pehmeäkantinen |
| ISBN | 9783031005756 |
Tietoa kirjasta
Discover the cutting-edge world of electronics with Three-Dimensional Integration and Modeling by Jong-Hoon Lee. Published by Springer International Publishing AG in 2007, this insightful paperback spans 108 pages and delves into advanced technologies for millimeter-wave passive front-ends.
This book covers essential topics such as three-dimensional packaging in multilayer organic substrates, microstrip-type integrated passives, and innovative cavity-type integrated passives. Additionally, it explores three-dimensional antenna architectures and fully integrated three-dimensional passive front-ends, making it an invaluable resource for professionals and students alike.
Whether you're looking to enhance your understanding of modern electronic design or seeking practical applications of three-dimensional integration, Jong-Hoon Lee's expert insights will guide you through the complexities of this evolving field. Don't miss the opportunity to enrich your knowledge with this comprehensive resource!