{"product_id":"three-dimensional-integration-and-modeling-springer-international-publishing-ag-9783031005756-a-revolution-in-rf-and-wireless-packaging-jong-hoon-lee","title":"Three-Dimensional Integration and Modeling","description":"\u003cp\u003eDiscover the cutting-edge world of electronics with \u003cstrong\u003eThree-Dimensional Integration and Modeling\u003c\/strong\u003e by Jong-Hoon Lee. Published by Springer International Publishing AG in 2007, this insightful paperback spans 108 pages and delves into advanced technologies for millimeter-wave passive front-ends.\u003c\/p\u003e \n\n\u003cp\u003eThis book covers essential topics such as three-dimensional packaging in multilayer organic substrates, microstrip-type integrated passives, and innovative cavity-type integrated passives. Additionally, it explores three-dimensional antenna architectures and fully integrated three-dimensional passive front-ends, making it an invaluable resource for professionals and students alike.\u003c\/p\u003e \n\n\u003cp\u003eWhether you're looking to enhance your understanding of modern electronic design or seeking practical applications of three-dimensional integration, Jong-Hoon Lee's expert insights will guide you through the complexities of this evolving field. Don't miss the opportunity to enrich your knowledge with this comprehensive resource!\u003c\/p\u003e","brand":"Jong-Hoon Lee","offers":[{"title":"Default Title","offer_id":52257023033686,"sku":"9783031005756","price":33.94,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0886\/3206\/6390\/files\/9783031005756.jpg?v=1767786919","url":"https:\/\/www.englishbook.fi\/products\/three-dimensional-integration-and-modeling-springer-international-publishing-ag-9783031005756-a-revolution-in-rf-and-wireless-packaging-jong-hoon-lee","provider":"Bookshop","version":"1.0","type":"link"}