{"product_id":"thermal-and-structural-electronic-packaging-analysis-for-space-and-extreme-environments-taylor-francis-ltd-9781032160818-juan-cepeda-rizo","title":"Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments","description":"\u003cp\u003eThis book provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars.\u003c\/p\u003e","brand":"Juan Cepeda-Rizo","offers":[{"title":"Default Title","offer_id":52257206796630,"sku":"9781032160818","price":151.56,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0886\/3206\/6390\/files\/9781032160818.jpg?v=1767787174","url":"https:\/\/www.englishbook.fi\/products\/thermal-and-structural-electronic-packaging-analysis-for-space-and-extreme-environments-taylor-francis-ltd-9781032160818-juan-cepeda-rizo","provider":"Bookshop","version":"1.0","type":"link"}