{"product_id":"supercharge-invasion-and-mudcake-growth-in-downhole-applications-john-wiley-sons-inc-9781119283324-wilson-chin","title":"Supercharge, Invasion, and Mudcake Growth in Downhole Applications","description":"\u003cp\u003e\u003cstrong\u003eSupercharge, Invasion, and Mudcake Growth in Downhole Applications\u003c\/strong\u003e by Wilson Chin, Tao Lu, Xiaofei Qin, Yongren Feng, Yanmin Zhou.\u003c\/p\u003e\n\u003cp\u003ePublished by Wiley \u0026amp; Sons, Limited, John, (2021), Hardback, 528 pages.\u003c\/p\u003e","brand":"Wilson Chin","offers":[{"title":"Default Title","offer_id":52258178007382,"sku":"9781119283324","price":226.68,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0886\/3206\/6390\/files\/9781119283324.jpg?v=1767788462","url":"https:\/\/www.englishbook.fi\/products\/supercharge-invasion-and-mudcake-growth-in-downhole-applications-john-wiley-sons-inc-9781119283324-wilson-chin","provider":"Bookshop","version":"1.0","type":"link"}