{"product_id":"encyclopedia-of-packaging-materials-processes-and-mechanics-set-1-die-attach-and-wafer-bonding-technology-a-4-volume-set-world-scientific-publishing-co-pte-ltd-9789811201110-avram-bar-cohen","title":"Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set)","description":"\u003cp\u003e\u003cstrong\u003eEncyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set)\u003c\/strong\u003e by Avram Bar-Cohen, Jeffrey C Suhling, Andrew A O Tay.\u003c\/p\u003e\n\u003cp\u003ePublished by World Scientific Publishing Company, (2019), Hardback, 1080 pages.\u003c\/p\u003e\n\u003cp\u003eTopics: Manufactures.\u003c\/p\u003e","brand":"Avram Bar-Cohen","offers":[{"title":"Default Title","offer_id":52275350045014,"sku":"9789811201110","price":1503.5,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0886\/3206\/6390\/files\/9789811201110.jpg?v=1767815003","url":"https:\/\/www.englishbook.fi\/products\/encyclopedia-of-packaging-materials-processes-and-mechanics-set-1-die-attach-and-wafer-bonding-technology-a-4-volume-set-world-scientific-publishing-co-pte-ltd-9789811201110-avram-bar-cohen","provider":"Bookshop","version":"1.0","type":"link"}