{"product_id":"advances-in-embedded-and-fan-out-wafer-level-packaging-technologies-john-wiley-sons-inc-9781119314134-steffen-kroehnert","title":"Advances in Embedded and Fan-Out Wafer Level Packaging Technologies","description":"\u003cp\u003e\u003cstrong\u003eAdvances in Embedded and Fan-Out Wafer Level Packaging Technologies\u003c\/strong\u003e by Steffen Kroehnert, Beth Keser.\u003c\/p\u003e\n\u003cp\u003ePublished by Wiley \u0026amp; Sons, Incorporated, John, (2019), Hardback, 576 pages.\u003c\/p\u003e\n\u003cp\u003eTopics: Integrated circuits, Electronic packaging.\u003c\/p\u003e","brand":"Steffen Kroehnert","offers":[{"title":"Default Title","offer_id":52254030463318,"sku":"9781119314134","price":141.8,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0886\/3206\/6390\/files\/9781119314134.jpg?v=1767782779","url":"https:\/\/www.englishbook.fi\/products\/advances-in-embedded-and-fan-out-wafer-level-packaging-technologies-john-wiley-sons-inc-9781119314134-steffen-kroehnert","provider":"Bookshop","version":"1.0","type":"link"}