{"product_id":"3d-integration-in-vlsi-circuits-taylor-francis-ltd-9781138710399-implementation-technologies-and-applications-katsuyuki-sakuma","title":"3D Integration in VLSI Circuits","description":"\u003cp\u003eThe goal of this book is to provide an understanding of the latest challenges and issues in 3D integration. The term 3D integration includes a variety of integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs.\u003c\/p\u003e","brand":"Katsuyuki Sakuma","offers":[{"title":"Default Title","offer_id":52253485302102,"sku":"9781138710399","price":206.12,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0886\/3206\/6390\/files\/9781138710399.jpg?v=1767781969","url":"https:\/\/www.englishbook.fi\/products\/3d-integration-in-vlsi-circuits-taylor-francis-ltd-9781138710399-implementation-technologies-and-applications-katsuyuki-sakuma","provider":"Bookshop","version":"1.0","type":"link"}