{"product_id":"3d-ic-and-rf-sips-advanced-stacking-and-planar-solutions-for-5g-mobility-john-wiley-sons-inc-9781119289647-lih-tyng-hwang","title":"3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility","description":"\u003cp\u003e\u003cstrong\u003e3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility\u003c\/strong\u003e by Lih-Tyng Hwang, Tzyy-Sheng Jason Horng.\u003c\/p\u003e\n\u003cp\u003ePublished by Wiley \u0026amp; Sons, Incorporated, John, (2018), Hardback, 464 pages.\u003c\/p\u003e\n\u003cp\u003eTopics: Mobile communication systems.\u003c\/p\u003e","brand":"Lih-Tyng Hwang","offers":[{"title":"Default Title","offer_id":52254401986902,"sku":"9781119289647","price":140.59,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0886\/3206\/6390\/files\/9781119289647.jpg?v=1767783296","url":"https:\/\/www.englishbook.fi\/products\/3d-ic-and-rf-sips-advanced-stacking-and-planar-solutions-for-5g-mobility-john-wiley-sons-inc-9781119289647-lih-tyng-hwang","provider":"Bookshop","version":"1.0","type":"link"}